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The TSMC N7 was the DUV variant, on which ZEN and RDNA were built.

TSMC N7+ is the EUV variant. Chip designs from the N7 DUV need to be remanufactured for the N7 + EUV. This is why the N7+ was never very popular, only Huawei and they were bullied by the United States. So Zen and RDNA don’t work on N7+.

Redesign, customers didn’t want it, and then came the N6: These are the production steps for the N7 + EUV in which 1-on-1 (design compatible) N7 DUV chip designs can be used.

unlike what @abstained from voting , @b2 صديق friend in a @Zavalon The claim is my opinion that there is no need for a new line for that. 90% of the steps/machines between the N6 EUV and the N7 DUV are equal.

N7 DUV is multiple engraving, so to speak, 3 small DUV lithography machines and extra engraving tools are needed, the EUV is single engraving, so only one large EUV machine, less engraving and cleaning. So there is more room left in the EUV compared to the DUV, only the ground load and the ability to put the Trumpf drive laser underground (container full) is an issue. This may have already been taken into account in the construction of the N7 lines.

If it doesn’t really work, put the EUV servos aside and draw the transmission lines. In a metal factory where I work myself, new processes are often introduced into existing lines. Not lean, but cost effective.

Huawei N7 + capa can also be used with the N6.

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On the other hand, the fact that it is not necessary to build new lines for the N6 does not mean that it will not happen: if there are many customers for the N7 DUV, the cost argument (use of existing N7 equipment) does not matter, it is really better to get new ad creatives .

[Reactie gewijzigd door kidde op 25 december 2021 11:39]

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